3D Integration, Temperature Effects, and Modeling

3D Integration, Temperature Effects, and Modeling

Abstract :-
Practical limits to device scaling are threatening the growth of integrated circuit (IC) technology. A breakthrough architecture is needed in order to realize the increased device density and circuit functionality that future high performance ICs demand. 3D integration is being considered as this breakthrough architecture. In this thesis, the limits to scaling are noted and the feasibility of overcoming these limits using 3D integration is presented. Continue reading 3D Integration, Temperature Effects, and Modeling